Won the 2023 Taiwan Excellence Award
The key components "grinding spindle" and "rotary table" are all equipped with high-precision, high-rigidity hydrostatic bearings developed by Grintimate.
Contact Us
Provide total solution for wafer grinding
Achieve 300mm Si wafer thinning thickness <100µm, TTV <2µm, Ra 0.01µm
Contact Us
GTR-1215 is available for various workpieces
It can process silicon substrate, Reclaimed wafer, up to 2000 µm thick Si wafer carrier, multi-chip of sapphires, 4”-8” SiC and Oxide/bumping wafer grinding
Contact Us
A simple and compact fully automatic grinder which adopts a single spindle, and single turn table structure
It can be Integrated automatic loading and unloading system to meet mass production needs
Contact Us
Previous slide
Next slide

Semiconductor Dedicated of Hydrostatic Wafer Grinder

Model number：GTR-1215

Characteristics

  • Won the 2023 Taiwan Excellence Award.
  • Online Monitor of Grinding status, prevent the wafer from being deformed and damaged.
  • Real-time monitoring of wafer thickness and automatic correction to ensure the accuracy of wafer thickness.
  • Chuck table could be customized according to the needs of different sizes wafers.
  • Achieve 300mm Si wafer thinning thickness <100µm, TTV <2µm, Ra 0.01µm
  • Especially designed for widely used in high hardness plane materials, rapid thinning, and achieve the effect of flattening.
  • Optional granite base.

Specification

Model Unit GTR-1215
Wheel Spindle
Spindle Type Hydrostatic
Spindle Accuracy (run-out) mm <0.001
Max. Wheel Spindle Speed rpm 0~3000
Grinding Wheel Size (Diameter) mm Ø304
Rotary Table
Table Type Hydrostatic
Rotary Table Accuracy (run-out) mm 0.001
Speed of Rotary Table rpm 5~300
Max. Table Load kg 500
Vacuum Chuck Diameter mm 4"~12"
Rotary Table Diameter mm 12"
Auto Dressing System
Dressing Wheel Diameter mm Ø150xØ90x20T
Min. Feed-rate sec. 0.1μm
Other
Net/Gross Weight kg 2800/3200
Machine Size (LxWxH) mm 1872x1215x2380

Application

total Solution

Products